Groundbreaking Ceremony for Vietnam’s First Semiconductor Chip Manufacturing Plant Attended by Party General Secretary and Prime Minister

The event was also attended by Politburo members: Phan Dinh Trac, Secretary of the Party Central Committee and Head of the Central Internal Affairs Commission; Nguyen Xuan Thang, Director of Ho Chi Minh National Academy of Politics and Chairman of the Central Theoretical Council; Deputy Prime Minister Nguyen Hoa Binh; General Phan Van Giang, Minister of National Defense; General Luong Tam Quang, Minister of Public Security; Nguyen Duy Ngoc, Secretary of the Hanoi Party Committee; and other Party Central Committee members, leaders of ministries, central agencies, and local authorities, as well as domestic and international organizations, businesses, and partners.

The project, implemented by Viettel under the Ministry of National Defense’s mandate and based on the Government’s resolution, marks a significant milestone. For the first time, Vietnam is establishing domestic semiconductor chip manufacturing capabilities, laying the foundation for mastering core technologies and developing a local semiconductor ecosystem.

The plant, located in Hoa Lac Hi-Tech Park (Hanoi) on a 27-hectare site, is designed to become a national infrastructure hub for research, design, testing, and semiconductor chip production. Once operational, it will support key national industries such as aerospace, telecommunications, IoT, automotive manufacturing, medical devices, and automation.

According to Viettel, a complete semiconductor chip undergoes six main stages: product definition, system design, detailed design, chip fabrication, packaging and testing, and integration and validation. Vietnam has previously participated in five of these stages; the fabrication stage—the most complex and critical—has not yet been achievable domestically. The new plant will complete the entire chip production process within Vietnam.

Semiconductor chip fabrication is one of the most intricate and demanding processes in modern technology. Starting from a nearly pure silicon wafer, a chip is created through 1,000 consecutive steps over three months. Even minor deviations at any stage can disrupt the entire process, requiring exceptionally high organizational, management, and technological expertise.

For Viettel, leading the semiconductor chip plant project is a continuation of its long-term core technology development strategy. The corporation has proactively prepared its workforce through specialized training, international cooperation, technology transfer, and accumulated experience from research, design, and chip applications in various technological systems and products.

The project will be implemented from 2026 to 2030, with phases including plant construction, technology transfer, process optimization, and operational efficiency enhancement. Long-term plans for the Hoa Lac plant include scalability, enabling Vietnam to gradually adopt more advanced semiconductor technologies.

The groundbreaking of the high-tech semiconductor chip plant is a pivotal moment in Vietnam’s technological capability development, contributing to the realization of the goal: “Technological Self-Reliance for a Sustainable Future.”

The Government’s Electronic Information Portal will provide further updates on this event.