Secretary-General Tô Lâm and Prime Minister Phạm Minh Chính attended the groundbreaking ceremony of Vietnam’s first semiconductor chip manufacturing plant – Photo: VGP/Nhật Bắc
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The project, led by Viettel, is part of a mission assigned by the Ministry of Defense, based on a government resolution. This marks a significant milestone as Vietnam establishes its first domestic semiconductor chip manufacturing capability, laying the foundation for mastering core technologies and developing a local semiconductor ecosystem.
Located in the Hòa Lạc High-Tech Park (Hanoi), the 27-hectare facility is designed to serve as a national infrastructure hub for research, design, testing, and semiconductor chip production. Once operational, it will cater to key national industries such as aerospace, telecommunications, IoT, automotive manufacturing, medical devices, and automation.
According to Viettel, a complete semiconductor chip undergoes six main stages: product definition, system design, detailed design, chip fabrication, packaging and testing, and integration and validation. While Vietnam has previously engaged in five of these stages, the most complex and critical stage—chip fabrication—has remained beyond domestic capabilities. The new plant will close this gap, enabling end-to-end chip production within Vietnam.
Semiconductor chip fabrication is one of the most intricate and disciplined technological processes today. Starting from a nearly pure silicon wafer, a chip is created through 1,000 consecutive steps over three months. Even minor errors at any stage can disrupt the entire production line, demanding exceptionally high levels of organization, management, and technological mastery.
For Viettel, leading the semiconductor chip plant project is a continuation of its long-term core technology development strategy. The corporation has proactively prepared its workforce through specialized training, international partnerships, and technology transfers, while also gaining experience from research, design, and chip applications in various technological systems and products.
Secretary-General Tô Lâm toured the exhibition area – Photo: VGP/Nhật Bắc
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The project is set to unfold from 2026 to 2030, with phases dedicated to plant construction, technology absorption, process optimization, and operational efficiency enhancement. Long-term plans include expanding the Hòa Lạc facility to support Vietnam’s gradual adoption of more advanced semiconductor technologies.
The launch of this high-tech semiconductor chip plant is a pivotal step in Vietnam’s technological capability-building journey, contributing to the realization of the vision: “Technological Self-Reliance for a Sustainable Future.”
– 10:25 16/01/2026
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